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We’re attending the Temperature Control and Logistics 2023 summit in Frankfurt on the 14th and 15th of June.
Our team of temperature-controlled packaging experts will be on site showcasing the next generation of cold chain pallet shipper: ORCA Pallet. As well as ORCA Pallet, the team will be showcasing our wide range of cold chain packaging solutions, and will have on-site demonstrations of our full range of ORCA Pallet packaging systems.
To find out more about our attendance at TCL 23, get in touch with us at compliance@intelsius.com.
We look forward to seeing you there.
